Samsung Electronics Semiconductor Business Overview

I. Core Business Structure

II. Key Technological Innovations

1. Advanced Process Leadership: Mass-produced the world’s first 3nm GAA (Gate-All-Around) process in 2022, launched the 2nm GAA process in 2025, and plans for the 1.4nm process in 2026, continuously pushing the limits of semiconductor manufacturing.
2. Memory Technology Breakthroughs:
   • Launched the world’s first 24Gb GDDR7 DRAM in 2025, with a 50% bandwidth increase.
   • Mass-produced the 9th-generation V-NAND (236 layers) with a single-chip capacity of 1Tb and a 30% cost reduction.
   • Scaled production of HBM3/HBM4 High Bandwidth Memory, providing critical computing power for AI servers and doubling its supply volume in 2025.
3. System Semiconductor Innovation: The Exynos 2600 (2026) adopts the 3nm process with an integrated advanced AI engine; the ISOCELL HP3 image sensor supports 200MP and delivers a 40% improvement in low-light performance.

III. Market Position & Financial Performance

• Global Semiconductor Giant: Surpassed Intel in semiconductor revenue for the first time in 2017 to become the world’s No.1; the DS division achieved 111.1 trillion KRW (approx. 84 billion USD) in revenue in 2024, a year-on-year increase of 67%.
• Memory Market Leader: Controls over 40% of the global memory chip market, with a DRAM market share of over 45% and a NAND market share of approximately 36.9%, ranking first in the world for both.
• Rapidly Growing Foundry Business: Surpassed 30 trillion KRW in foundry revenue in 2025, secured major orders from NVIDIA, Qualcomm and other leading clients, and challenged TSMC’s dominant position.

IV. Key Milestones in Development

V. Strategic Layout

1. Two-pronged Expansion: Invested 171 trillion KRW (2020-2030) with the goal of becoming the global No.1 in both memory chips and semiconductor foundry.
2. AI & HPC: Increased investment in high-performance memory such as HBM and GDDR7 to meet the explosive demand for AI servers.
3. Automotive Electronics: Established a dedicated division to develop automotive-grade memory and processors, targeting to become one of the world’s top 3 automotive semiconductor suppliers by 2030.
4. Green Manufacturing: Promoted BSPDN and optical component technologies, reducing energy consumption by 30% to achieve sustainable development.