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Introduction

Key Features

• High-speed LPDDR4 architecture: 16Gb (2GB) capacity with 512M × 32 organization, 8 banks and dual channels for maximum bandwidth utilizationSamsung Semiconductor Global
• Data transfer performance: up to 3733Mbps (LPDDR4-3733) data rate with 1.866GHz clock frequency for seamless multitasking and high-throughput applications
• Advanced process technology: 10nm-class manufacturing process for improved performance, power efficiency and thermal management
• Triple voltage system: VDD1 (1.8V) for I/O, VDD2/VDDQ (1.1V) for core operations, reducing overall power consumption by up to 20% compared to previous generations
• Low-power design: supports multiple power-saving modes (including deep power-down) for extended battery life in portable devices
• High-reliability features: built-in ECC (Error Correction Code) support for data integrity, and industrial-grade temperature tolerance (-25°C to +85°C)Samsung Semiconductor Global
• Compact form factor: 200-pin FBGA package (10×15mm) enabling space-efficient PCB layouts in slim and compact devices
• Read-while-write capability: dual-bank architecture allows simultaneous read and write operations for improved system responsiveness
• RoHS compliant: lead-free and halogen-free packaging meeting environmental protection standards
• Product status: EOL (End of Life) - discontinued by Samsung, but still available through authorized distributorsSamsung Semiconductor Global

Typical Applications

• Industrial automation controllers and PLCs requiring high-speed data processing and multitasking capabilities
• IoT gateways and edge computing nodes with high-bandwidth sensor data acquisition and real-time analytics
• Smart medical devices (portable diagnostic instruments, patient monitoring systems) requiring low power consumption and reliable memory performance
• Automotive infotainment systems, ADAS (Advanced Driver Assistance Systems) and vehicle control units (VCUs)
• High-end consumer electronics (smartphones, tablets, VR/AR devices, ultra-thin laptops) with slim design requirements
• Digital signage and human-machine interface (HMI) systems with high-resolution graphics rendering needs
• Communication equipment (routers, switches, 5G base stations) requiring high-speed memory access for packet processing
• Embedded vision systems and image processing modules with large data throughput requirements
• Battery-powered portable devices (wearables, handheld scanners, industrial field devices) needing optimized power efficiency
• Smart home appliances and hubs with multimedia processing capabilities and compact form factors