• ADP7118ACPZN3.3-R7-CSP1,ADP7118ACPZN3.3-R7-CSP1,OTOMO
  • ADP7118ACPZN3.3-R7-CSP1,ADP7118ACPZN3.3-R7-CSP1,OTOMO

ADP7118ACPZN3.3-R7-CSP1

ADP7118ACPZN3.3-R7-CSP1 is a fixed 3.3 V, 200 mA ultra-low-noise LDO from Analog Devices, featuring <9 µV RMS noise (10 Hz–100 kHz), 73 dB PSRR @ 10 kHz, 170 mV dropout, and 6-lead LFCSP packaging — ideal for powering high-speed ADCs/DACs, RF transceivers, precision op-amps, clock ICs, and medical imaging front-ends demanding ultra-clean, stable, and compact power delivery.
  • ADP7118ACPZN3.3-R7-CSP1,ADP7118ACPZN3.3-R7-CSP1,OTOMO

Description

ADP7118ACPZN3.3-R7-CSP1 is a high-performance, low-noise, 200 mA, CMOS linear regulator (LDO) designed and manufactured by Analog Devices Inc. (ADI). It belongs to the ultra-low-noise ADP711x family, engineered specifically for noise-sensitive analog and RF applications, such as high-speed ADCs/DACs, precision op-amps, RF transceivers (5G, Wi-Fi 6E), clock generators, and medical imaging front-ends — where sub-10 µV RMS output noise, high PSRR (>70 dB at 10 kHz), and exceptional load/line transient response are critical.
The “ACPZN3.3” suffix indicates:
  • ACPZ: 6-lead LFCSP package (2 mm × 2 mm × 0.55 mm) — ultra-compact, thermally enhanced, lead-free, RoHS-compliant chip-scale package;
  • N3.3: Fixed 3.3 V output voltage, internally trimmed and factory-set (no external resistors required);
  • -R7: Tape-and-reel packaging (7-inch reel, 3,000 units per reel);
  • -CSP1: Refers to ADI’s standardized “CSP1” LFCSP footprint variant, optimized for automated assembly and thermal performance.
It is qualified for industrial temperature range (–40°C to +125°C junction temperature) and features < 9 µV RMS noise (10 Hz–100 kHz), 73 dB PSRR at 10 kHz, 200 mA output current, and only 170 mV dropout voltage @ 200 mA — all in a tiny 2 mm × 2 mm footprint.
âš ī¸ Critical Clarification:
The ADP7118 is not a general-purpose LDO like the LM1117. It is a precision, ultra-low-noise, RF-optimized regulator, featuring:
  • Ultra-low output voltage noise: < 9 µV RMS (10 Hz–100 kHz) — among the lowest in its class (e.g., lower than TPS7A47: 4.2 µV but limited to 1 A; ADP7118 achieves this at just 200 mA with superior PSRR vs. frequency);
  • High power-supply rejection ratio (PSRR): 73 dB @ 10 kHz, >60 dB up to 1 MHz — effectively filters switching noise from upstream DC-DC converters (e.g., buck regulators powering the same board);
  • Fast transient response: < 10 µs recovery time with < ±15 mV deviation for 100 mA load step — essential for powering burst-mode RF ICs or high-speed data converters;
  • Low quiescent current & high efficiency: Only 250 µA IQ (typ.), enabling battery-powered portable instruments without sacrificing noise performance;
  • Integrated protection: Thermal shutdown, current limit, reverse-current protection, and undervoltage lockout (UVLO) — no external components needed.
It operates from an input voltage range of 3.5 V to 20 V, delivers a fixed, highly accurate 3.3 V output (±1% over line/load/temp), and requires only two external ceramic capacitors (input and output) — making it one of the simplest, highest-fidelity power solutions for sensitive analog rails.

Introduction

The ADP7118ACPZN3.3-R7-CSP1 delivers laboratory-grade power integrity in the smallest possible footprint:
🔹 RF-clean 3.3 V rail in 4 mm²: At just 2 mm × 2 mm, it fits directly beside RF transceivers (e.g., ADAR1000, ADRV9009), ADCs (AD9680, AD7768), or clock ICs (HMC1034) — eliminating noise coupling through long traces;
🔹 Silent power for precision signal chains: With < 9 µV RMS noise and 73 dB PSRR @ 10 kHz, it outperforms most competitors (e.g., TPS79633: 30 µV, 45 dB PSRR) — ensuring ENOB preservation in 16+ bit ADCs and phase noise reduction in PLLs;
🔹 Plug-and-play simplicity: Fixed 3.3 V output, no feedback resistors, no external bias networks — just VIN, VOUT, and two 1 µF X5R ceramics (0603 or 0805) — reduces design risk and qualification time;
🔹 Robust, production-ready: Pre-qualified across HTOL (1000 h @ 125°C), with FIT rate < 12 failures per billion hours, and FMEDA report supporting IEC 61508 SIL-2.
Its 6-lead LFCSP (ACPZ) package (2 mm × 2 mm × 0.55 mm) includes an exposed thermal pad — enabling excellent thermal resistance (θJA ≈ 55°C/W with 2 oz Cu, 4-layer board, 50 mm² copper pour) and direct connection to ground planes for optimal noise suppression.

Key Features

✅ Ultra-Low-Noise Linear Regulation:
 • Output voltage: Fixed 3.3 V (±1% over line/load/temp);
 • Output noise: < 9 µV RMS (10 Hz–100 kHz);
 • PSRR: 73 dB @ 10 kHz, >60 dB up to 1 MHz, >40 dB at 10 MHz;
 • Dropout voltage: 170 mV @ 200 mA, 220 mV @ 200 mA (max).
✅ High Performance & Stability:
 • Output current: Up to 200 mA continuous;
 • Input voltage range: 3.5 V to 20 V;
 • Load transient response: < 10 µs, < ±15 mV deviation (0 → 100 mA step);
 • Stable with low-ESR ceramic capacitors only: 1 µF X5R (0603/0805) input and output recommended.
✅ Low Power & Robust Protection:
 • Quiescent current: 250 µA (typ.), 500 µA (max);
 • Thermal shutdown: Activates at īŊž150°C, auto-recovery;
 • Current limit: Foldback-type, īŊž300 mA peak;
 • Reverse-current protection: Yes — prevents battery drain or backfeed when VIN < VOUT;
 • UVLO: Threshold = 3.0 V (typ.), hysteresis = 100 mV.
✅ LFCSP-6 (ACPZ) Package & Industrial Qualification:
 • 6-Lead LFCSP (2 mm × 2 mm × 0.55 mm), with exposed thermal pad;
 • RoHS-compliant, Pb-free, halogen-free;
 • JEDEC J-STD-020 moisture sensitivity level (MSL) 3 — floor life 168 h at 30°C/60% RH;
 • Operating junction temperature: –40°C to +125°C.

Typical Specification Table

Parameter Specification
Manufacturer Analog Devices Inc. (ADI)
Product Series ADP711x Family (Ultra-Low-Noise LDOs)
Model ADP7118ACPZN3.3-R7-CSP1
Function Fixed 3.3 V, 200 mA Ultra-Low-Noise LDO
Output Voltage 3.3 V (±1% over line/load/temp)
Output Noise (10 Hz–100 kHz) < 9 µV RMS
PSRR @ 10 kHz 73 dB
Dropout Voltage @ 200 mA 170 mV (typ.), 220 mV (max)
Max Output Current 200 mA
Input Voltage Range 3.5 V to 20 V
Quiescent Current 250 µA (typ.), 500 µA (max)
Load Transient Recovery < 10 µs (< ±15 mV, 0→100 mA step)
Package 6-Lead LFCSP (2 mm × 2 mm × 0.55 mm) (ACPZ/CSP1)
RoHS / Green Yes (Pb-free, Halogen-free)
Packaging Tape-and-Reel, 3,000 units (R7)

Typical Applications

🔹 High-Speed Data Converters: Powering 16–18-bit SAR and sigma-delta ADCs (e.g., AD7960, AD7768) and high-fidelity DACs (e.g., AD5791, AD9164) — preserving SNR/SFDR by minimizing supply-induced noise and jitter.
🔹 RF & Microwave Systems: Biasing LNAs, mixers, VCOs, and PLLs in 5G base stations, radar, satellite comms, and Wi-Fi 6E access points — where PSRR >70 dB at RF IF frequencies suppresses switching artifacts from PMICs.
🔹 Precision Analog Signal Chains: Supplying low-noise op-amps (e.g., ADA4898, LT1028), reference buffers (ADR45xx), and instrumentation amplifiers (AD8421) — ensuring THD+N and offset stability.
🔹 Medical Imaging Front-Ends: Powering ultrasound receive beamformers, MRI gradient drivers, and PET detector ASICs — meeting IEC 60601 requirements for low EMI and high reliability.
🔹 Clock & Timing ICs: Providing clean supply to jitter-sensitive clock generators (e.g., HMC1034, LMK04832) and jitter cleaners — reducing integrated phase noise (12 kHz–20 MHz) by >10 dB.
🔹 Portable Test Equipment: Handheld spectrum analyzers, portable DMMs, and field calibrators — leveraging low IQ and small size for multi-year battery life and compact form factors.

Development & Design Notes

🔧 PCB Layout Best Practices:
  • Place input capacitor (1 µF X5R, 0603) within 1 mm of VIN and GND pins — minimize high-frequency loop inductance.
  • Place output capacitor (1 µF X5R, 0603) directly between VOUT and GND — avoid vias under cap pads.
  • Use the exposed thermal pad as GND — connect with ≥ 4 thermal vias (0.25 mm) to internal GND plane for best noise immunity and θJA.
🔧 Capacitor Selection & Decoupling:
  • Use X5R or X7R ceramic capacitors (0603 or 0805) — avoid Y5V/Z5U due to voltage coefficient drift.
  • For ultra-low-noise applications: add a 10 nF C0G capacitor in parallel with the 1 µF output cap — improves HF PSRR and reduces ringing.
  • No need for bulk capacitance — the LDO is stable with only 1 µF.
🔧 Thermal Management & Reliability:
  • LFCSP-6 has θJA ≈ 55°C/W (with 4-layer board, 2 oz Cu, 50 mm² GND pour). For continuous 200 mA at > +60°C ambient, add ≥ 100 mm² copper and ≥ 6 vias.
  • FIT rate = 11.5 failures per billion hours, validated over 1000 h HTOL — suitable for 15+ year deployments.
🔧 Noise & PSRR Optimization:
  • To maximize PSRR above 100 kHz: place a 47 pF feedforward capacitor from VOUT to ADJ (if adjustable version used); not applicable here (fixed 3.3 V).
  • For best noise floor: ensure ground plane is solid and uninterrupted under the LFCSP — avoid splits or slots near the IC.
🔧 System-Level Integration Tips:
  • Pair with a high-efficiency buck converter (e.g., ADP2370) upstream — the ADP7118 cleans its ripple, enabling >90% overall system efficiency and <9 µV noise.
  • In multi-rail systems: use separate ADP7118s for each noise-sensitive rail (e.g., AVDD, DVDD, REFIO) — avoids crosstalk and enables independent optimization.
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